CALL FOR PAPERS
Design By Data: Cultivating Datasets For Engineering Design
Journal of Mechanical Design, Special Issue
We invite you cordially to contribute to the Journal of Mechanical Design's upcoming Special Issue, "Design by Data: Cultivating Datasets for Engineering Design." In an era where the influence of data is increasing across disciplines, this issue aims to underscore its revolutionary impact on engineering design—spanning theory, decision-making, and optimization to educational curricula.
We are calling for papers that explore data-driven methods in design, engage in insightful discussions about their data, and publicly release their datasets. This special issue aims to address challenges in engineering dataset creation, such as multi-modality, managing missing information, and ensuring data quality, among others. Please see the detailed submission guidelines and scope at asmejmd.org/2024/02/14/design-by-data-cultivating-datasets-for-engineering-design/
Paper Submission Deadline: June 1, 2024
Submissions should be made electronically via the ASME Journal Tool at journaltool.asme.org/home/index.cfm. Please select the ASME Journal of Mechanical Design and then the special issue on "Design by Data: Cultivating Datasets for Engineering Design."
Your expertise and contribution would significantly enhance the breadth and depth of discussions around design datasets within this special issue. We look forward to your submission.
Regards,
Michael, on behalf of all guest editors
Guest Editors:
Dr. Faez Ahmed, Massachusetts Institute of Technology, faez@mit.edu
Dr. Cyril Picard, Massachusetts Institute of Technology, cyrilp@mit.edu
Dr. Michael Kokkolaras, McGill University, michael.kokkolaras@mcgill.ca
Dr. Wei Chen, Northwestern University, weichen@northwestern.edu
Dr. Christopher McComb, Carnegie Mellon University, ccm@cmu.edu
Dr. Pingfeng Wang, University of Illinois Urbana-Champaign, pingfeng@illinois.edu
Dr. Ikjin Lee, Korea Advanced Institute of Science & Technology, ikjin.lee@kaist.ac.kr
Dr. Tino Stankovic, ETH Zurich, tinos@ethz.ch
Dr. Douglas Allaire, Texas A&M University, dallaire@tamu.edu
Dr. Stefan Menzel, Honda Research Institute Europe, stefan.menzel@honda-ri.de